Clean Room (MNCR)

General purpose solvent fume hood.

The Spin Rinse Dryer sprays DI water through a dedicated rinse manifold. Water is then purged from the process chamber using heated N2. The system can only accommodate round wafers at fixed Semi standards (3”, 4”, 6” and 8”).

The RCA wet bench is dedicated to CMOS compatible substrates only.  It is capable of up to 8” wafer processing and is solely used in conjunction with RCA chemistries.

CMOS-compatible samples only. 

The PlasMod is a compact oxygen plasma asher capable of processing up to 4” diameter samples.  A direct oxygen based RF plasma is used for multiple applications ranging from photoresist stripping, organic cleaning, and surface modification.

The PlasmTherm system has one chamber dedicated to RIE processing.  Standard recipes are supplied for semiconductor material etching using fluorinated chemistries including SF6, CHF3, and CF4.  The chamber can accommodate samples up to 8” in diameter. 

No toxics. 

The PlasmTherm system has one chamber dedicated to PECVD processing.  Standard recipes include silicon dioxide and silicon nitride depositions at a nominal operating temperature of 300C and 250C respectively.  The chamber can accommodate samples up to 8” in diameter.  Maximum film thickness top out at about 1um.   

No volatiles or toxics allowed. 

The PicoSun ALD system is capable of running in both thermal and plasma enhanced mode.  The sample holder can accept up to 8” wafers and has a maximum operating temperature of 400C although many processes are enabled at significantly lower temps.  It’s configured for up to five precursor reagents and 3 plasma gases (N2, H2, and O2).  Maximum film thicknesses are typically less than 0.5um.  

No volatiles or toxics allowed. 

The photoresist strip bench uses an NMP based organic solvent to dissolve most crosslinked and non-crosslinked photoresists.

Incompatible with copper and not effective on SU-8.

The parlyene system deposits a highly conformal polymeric coating on any exposed sample surfaces.  The film thickness can be controlled from a few nanometers to multiple microns.  It’s commonly used as a vapor/permeation barrier and hydrophobic coating.  It is also well known for being biologically inert.

The OAI contact aligner is broadband mid-UV exposure tool.  It can expose samples ranging in size from small pieces up to 8” wafers.  It has a dual optic alignment system capable of ~1um in mask to frontside overlay and ~20um in backside to frontside sample overlay.  Image size reproducibility is limited to 1um.