Clean Room (MNCR)

The MTI is an LPCVD system configured for graphene growth.  Supply gases include methane, argon, nitrogen and hydrogen.  Base vacuum is below 100mT and maximum operating temperature is 1100C.

The MPT RTA is a radiation based rapid thermalization tool capable of processing up to 4” wafers.  Offered atmospheric gas ambients include N2 and O2.  Controlled temperature capability runs from 300C to 1000C with exposure durations on the scale of minutes.

No volatiles, toxics, or glass without staff permission.

The MBJ3 is broadband MUV contact lithography tool capable of reproducing linewidths down to 1um.  Diverse substrate types and sizes (up to 3 inch) can be accommodated.  There is a single field alignment microscope allowing for overlay tolerances of several microns.  

RMC Powertome XL microtome is used for the preparation of thin sections of specimens for electron microscopy
 

Features:

• Thick/thin sectioning ranges from 20-999 nm.
• Cryostage compartment with a temperature control from -120 °C to room temperature.

Available Knives:

The Lindberg system is a high temperature convective tube furnace capable of processing up to 2.5” samples.  Offered atmospheric gas ambients include Ar and O2.  Controlled temperature capability runs from 500C to over 1200C with exposure durations on the scale of hours.

No volatiles, toxics, or glass without staff permission.  Metals below melting point are permitted.

The Lindberg system is a high temperature convective tube furnace capable of processing up to 1.5” samples.  Offered atmospheric gas ambients include N2, Ar, and O2.  Controlled temperature capability runs from 500C to 1000C with exposure durations on the scale of hours.

The manual wedge wire bonder offers the versatility to bond simple discrete devices up to complex hybrid, microwave devices. Individual bond parameter and loop height control. Consistent tail length. Can be configured for gold or aluminum wire sizes from 0.7 to 3.0 mil. Includes heated work holder and stereo-zoom microscope.

The K&S 4524 Ball Bonder with digital controls is an advanced bench-top gold ball bonder capable of ultrasonically bonding gold wires from 18 - 75 micron.

The Jipelec RTA is a radiation based rapid thermalization tool capable of processing up to 6” wafers.  Offered atmospheric gas ambients include Ar, Ar/H2 and ethylene.  Controlled temperature capability runs from 300C to 1000C with exposure durations on the scale of minutes.

No volatiles, toxics, or glass without staff permission.

The anneal system is a high temperature convective tube furnace capable of processing up to 0.5” samples.  Offered atmospheric gas ambients include Ar and O2.  Controlled temperature capability runs from 500C to over 1400C with exposure durations on the scale of hours.