The Heatpulse RTA is a radiation based rapid thermalization tool capable of processing up to 4” wafers. Offered atmospheric gas ambients include N2, Ar and O2. Controlled temperature capability runs from 300C to 1000C with exposure durations on the scale of minutes.
No volatiles, toxics, or glass without staff permission.
The Headway spin coater uses centrifugal force to uniformly coat fluids across a substrate surface. Small pieces through 6” wafers can be processed through the coater with the correct corresponding spin chuck. The programmable controller can handle multistep recipes with spin spins up to 800RPM.
All photoresist materials and/or staff approved materials only.
This Headway system is used is spin coat liquid materials, solutions or suspensions. The spindle is controlled manually using the installed rotational tachometer. Up to 4” substrates can be processed.
The UV flood exposure system is a fast and easy way to utilize ozone and oxygen radicals species to clean organics from a sample surface. The system can also be used as a surface modifier for oxidation and terminal bonds. Samples up to 6” in diameter can be processed in the machine.
The Fineplacer system is a multipurpose bonder which offers ~5um placement accuracy. This versatile platform is used for various applications such a flip chip bonding, die bonding and micro-assembly.
Electrostatic manipulator can be used to lift-out TEM samples as well as lift and move micron sized flakes and particles into positions of interest.
The Edwards thermal evaporator is a cryo-pumped system for depositing thin films. It is currently configured with two power sources capable of performing a binary sequential or co-evaporative process.
No toxics.
The develop bench is used as part of the lithography process to dissolve away non-cross linked polymeric films (photoresist). Submersion based development can be accommodated for samples up to 8” in diameter.
Aqueous hydroxide based develop solutions only.
The Despatch is a high uniformity convection oven commonly used for resist post bakes. The oven is typically kept at 120C but has the ability to achieve ~200C. All baking is at atmospheric pressure in room air.
The Denton is a tabletop sputter coater most commonly used for SEM sample preparation. It is equipped with a platinum target for depositing a very thin conductive film on the sample surface. Maximum sample size is approximately 2”.