Clean Room (MNCR)

Zeiss Supra Nabity E-beam

The Zeiss SUPRA 55 is a FESEM with a Schottky thermal field emission source. It has an ultimate imaging resolution in the range of 2nm. The SUPRA has multiple detectors for Secondary Imaging as well as Backscatter. The system has been setup with a blanker and a control system that can be used for doing electron beam lithography. The Nabity system is able to read standard CAD files, DFX, and GDSII formats. In e-beam lithography mode 20nm-50nm feature sizes are attainable.

Trion RIE

The Trion is an ICP-RIE system with both fluorinated and chlorinated chemistries.  The system has recipes for semiconductor, compound semiconductor, and metal plasma etching.  The ICP option allows for quasi-independent control of plasma density and ion bombardment energy reducing physical damage while retaining high etch rates and selectively.

No toxics.

Thermocarbo Dicing Saw

The TCAR 864 is a diamond bladed programmable dicing saw.  It’s capable of cutting into, or through, multiple types of substrates with industry leading precision.  The machine can handle sample sizes ranging from pieces up to 6” wafers. 

No toxics. 

Temescal e-Beam Evaporator (1)

The Tesmescal is a cryo-pumped high vacuum system for PVD thin films.  Most commonly used as an electron beam technique it is also capable of thermal evaporations for some materials.  Users must provide their own source materials and crucible, if required.  The planetary can accommodate up to 8” samples.

No toxics or copper. 

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