Characterization Equipment

Optical white light microscope with objective magnifications of 5x, 20x, 50x, and 100x.

The USB4000-UV-VIS is a miniature spectrometer preconfigured for general UV-Vis measurements from 200-850 nm including absorption, transmission, reflectance and emission.

Optical microscope with video capture capability.  Brightfield and darkfield observation modes can be used in conjunction with magnification lenses of 5x, 10x, 20x, 50x and 100x.

The Hysitron TI900 Triboindenter is an automated, high-throughput system for a complete nanomechanical characterization.
 

Available Modes of Operation:

The Keithley 4200 is a modular and fully-integrated parameter analyzer that provides analysis into current-voltage and capacitance-voltage behavior.

The Keithley 4200 is a modular and fully-integrated parameter analyzer that provides analysis into current-voltage and capacitance-voltage behavior.

The ellipsomster is non-contact measurement system for measuring the thickness and optical properties of thin films.  Our system samples over 44 discrete wavelengths, over the white light spectrum, and can incorporate varied incident angles as well.  Films from ~1um down to single nanometers can be measured with accuracy and repeatability.

The Perkin Elmer Spectrum One FT-IR Spectrometer works in a range of 4000 - 350 cm-1 with a 0.5 cm-1 resolution and equipped with a mid-range Deuterated triglycine sulfate (DTGS) infrared detector.

Available sample holders

The Filmetrics F40 interferometer provides users with rapid thin film thickness and optical constants measurements on most common device film stacks.  A 30um spot size can be placed on patterned samples, from pieces up to 8” wafers.  Transparent films from ~50nm to tens of microns can be measured.

The VERSA 3D Dual Beam combines scanning electron microscopy (SEM) and Focused Ion Beam (FIB) in a single platform that allows switching between two modes of operation. The samples can be milled via ion beam and deposited with platinum while observing the process. The milling and deposition processes can be performed on pre-adjusted patterns as well as externally provided patterns. In addition to secondary electron imaging, backscattered electron imaging is available where the two images can be combined to observe the contribution of each.