Characterization Equipment

A 4 point probe system for doing test probing on a near nano-scale. It can be paired with one of the center’s Keithley Analyzers for electrical characterization. This system is staff operated only.

The XPS system provides detailed surface chemistry at the sub-10 nm scale. It operates by spectroscopy of photo-electrons emitted from the sample surface by incident X-Ray or ultra-violet photons. These photoelectron energies provide highly sensitive information on chemical species and bonding in the sample surface region. The spatial resolution of this technique is about 10 mm, with a spectral resolution of < 0.5 eV.

The D-3100 has a large sub-stage which can handle 6 inch wafers. It has the ability to do tapping and contact modes. The system has other modules for doing CAFM, TUNA, MFM, Wet cell images, and STM. The results of each of these modules are based on the proper imaging conditions being met and having proper control samples to verify system performance.

The Perkin Elmer Lambda 950 UV-Vis-NIR spectrophotometer displays ultra-high UV/Vis/NIR performance for wavelengths up to 3300 nm, high precision measurements, and for applications such as highly reflective and anti-reflective coatings, color correction coatings. Its wavelength range is 175 – 3300 nm with less than 0.05nm resolution. It is a double beam, double monochromator, ratio recording UV/Vis/NIR spectrophotometer with microcomputer electronics. The detector is a Photomultiplier R6872 for high energy in the whole UV/Vis wavelength range.

The Thermo Scientific Genesys 10 UV-Vis spectrophotometer operates in single wavelength mode with a range of 325 – 1100 nm with 1.0 nm accuracy. The instrument has a photometric range of 0.3 to 125% transmittance and -0.1 to 3.0 absorbance. Six-cell position models accommodate 10-mm square cuvettes or 10-mm, 1⁄2" dia test tubes.

Specifications

The Flexus us a stress measurement instrument that measures the change in the radius of curvature of a wafer caused by the deposition of a thin film.  Given the properties of the substrate the software can then calculate the stress of the applied film and the thermal coefficient of expansion.  Wafers from 3” to 8” can be analyzed.

No volatiles if heated. 

The Suss probe station allows electrical test of up to 6” wafers using 4 manual micromanipulators.  The test station is also equipped with a heated stage and set up to be used in conjunction with the Keithley 4200 parametric analyzer.

Rigaku's XtaLAB SynergyS Dual Source Single Crystal Diffractometer is a top-of-the-line instrument and features powerful X-ray beam from rotating anode with dual wavelength (Mo and Cu) coupled with Rigaku’s HyPix-6000HE Detector allowing extremely low noise, essentially zero deadtime and true shutterless data collection. It is also possible to collect data at 100K using the Oxford Cryosystems Cryostream 800 low temperature system. Data integration is carried out using CrysAlisPro.

The Oxford INCA system has a 10mm2 detector with 140eV resolution. The system can do basic elemental analysis as well as mapping, line scans and point/ area analysis off of an image. All the data can be exported to Word, or taken as raw data in the form of EMSA file.

The Oxford AZTEC system is fitted out with a state of the art peltier cooled SDD x-ray detector. It has high count rate capabilities with an 80mm2 detector. The system also has a high sensitivity EBSD camera for doing Electron Backscattered Defraction imaging and mapping. The EBSD camera is mounted with a 4 channel fore scattering detector system for enhanced imaging and data acquisition. The system can do spectral analysis, mapping, linescans and point/area analysis. All the data can be exported to Word, or taken as raw data in the form of EMSA file.