Center for Materials, Devices and Integrated Systems Seminar
December 3 (Friday), 2021: 12:00 pm – 1:00 pm (EST)
“Frontiers in Semiconductor Packaging”
by: Dr. Shripad Gokhale
Principal Engineer- Semiconductor Packaging R&D at Intel Corporation
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Abstract: With Computing world demanding higher performance, higher bandwidth and memory, and lower power and smaller form factors; advanced packaging is becoming a key enabler of the future of semiconductor roadmap. This presentation will introduce new advances in semiconductor packaging, focusing mainly on heterogenous integration. It will describe Intel’s recent advances in this field. Intel’s leadership in packaging technology will be introduced.
The presentation will also focus on die to wafer interconnect technology for heterogeneous integration, some of the future challenges, and some of the technical innovations that are critical to enable future directions.
Biography: Shripad received his Ph.D. from Rensselaer Polytechnic Institute in 2005 and B.S. in Chemical Engineering from UDCT Mumbai, India in 2000. He joined Intel in 2005. His focus is on Semiconductor Packaging Research and Development. His area of expertise is in Assembly process, Materials and Tool Technologies, and Wafer Level Assembly. He has held several senior engineering and management positions at Intel in packaging process technology development group for the past 16 years of his career at Intel.
For the past 6 years, he is leading Intel’s Foveros 3D Die Stacking Technology Research and Development as a Principal Engineer (PE) in Assembly Packaging organization. Shripad has won Intel Achievement Award (IAA) in 2019 for the Wafer Assembly Technology Development for Foveros program. Shripad holds 8 patents, 2 trade secrets, and has co-authored Intel internal journal papers and in IEEE journal.
Shripad is delighted to share Intel’s advances in semiconductor packaging, highlighing some of the future directions for the field; and connect to his RPI roots.
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contact: Deniz Rende (rended3@rpi.edu)