BYOND: Build Your Own Nano Device - Enrichment Opportunity and Certificate Program

The Micro and Nanofabrication Clean Room (MNCR) facility within the Center for Materials, Devices and Integrated Systems (CMDIS) is a Class-100 facility located on the 4th Floor of the Center for Industrial Innovation (CII) building. The MNCR offers a broad range of processing, measurement and fabrication tools for microelectronics, optoelectronics, MEMS and other small-scale devices. The MNCR has equipment that enables deposition and etching of thin films, patterning of devices and nanostructures, wet chemical processing and metrology capabilities. 

The growing semiconductor and electronic devices industries, as well as pharmaceutical, medical, optical, solar and aerospace industries depend on cleanroom technologies where the contamination is controlled. With the increasing demand for engineers and scientists with focused training in cleanroom operations, we are offering a certificate program for undergraduate students to start building a foundation. This certificate program is an exciting opportunity for undergraduates, both for those planning to pursue a graduate degree or those looking to prepare for a professional career. 

This certificate program is designed to introduce microfabrication and analysis concepts to interested undergraduate students. The program currently offers four modules with each module running over a four-week period.  Each weekly lab session will last approximately two hours and will consist of both classroom instruction and a hands-on laboratory demonstration. A student may take any offered module in any order and is expected to attend each of the four weekly lab sessions.  By completing all four modules, the student will be awarded a Microelectronics concentration certificate and be allowed access to cleanroom lab space.   

Program and Modules 


Module 1

Module 2

Module 3

Module 4

Week 1

Spin Coating

Vacuum Science

Optical Microscopy

Wet Etch

Week 2

Optical Lithography

Chemical Vapor Deposition

Contact  Techniques

Plasma Physics

Week 3

Maskless Lithography

Physical Vapor Deposition

Non-contact Techniques

Reactive Ion Etching

Week 4

E-beam Lithography

Atomic Layer Deposition

Scanning Electron Microscopy

Gas Delivery and Abatement

Spring 2023 Schedule:
Module 2 (Deposition): 02/06-03/03
Module 3 (Metrology): 03/13-04/07

Application Deadline: 01/18, Wednesday, 5:00pm

Admission Requirements:
1. Any RPI undergraduate student who has an interest in the field.
2. The capacity for each module is 5 students and selection will be made based on interest and background.
3. The 2 hour weekly schedule will be determined on the first meeting.