Greetings from RPI @ Albany Nano!
We invite you to the third RPI @ Albany Nano Spring Seminar Series, on March 27th, Wednesday, 12:00pm-2:00pm, at CESTM Auditorium (ANT). Registration is required for all attendees, feel free to forward this email to faculty, researchers, students, anyone who might be interested.
RPI @ Albany Nano, Spring Seminar Series
27 March 2024, Wednesday, 12:00 pm – 2:00 pm
Albany NanoTech Complex, CESTM Auditorium
Foundry Fabricated Slow-light Photonic Devices for Communication and Computing Applications
Rena Huang, Rensselaer Polytechnic Institute
The AIM Photonics Ecosystem and Technology Offerings
Colin McDonough, AIM Photonics
In-person seminar, registration required.
Foundry Fabricated Slow-light Photonic Devices for Communication and Computing Applications
Rena Huang
Associate Professor, ECSE, Rensselaer Polytechnic Institute
Abstract: Silicon photonics has emerged as a promising technology for revolutionizing communication and computing systems due to its compatibility with existing CMOS fabrication processes and potential for high integration density. In this seminar, we explore the advancements in foundry-fabricated compact Si modulators tailored for diverse applications. Traveling wave resonant structures interacting with carrier plasma can lead to slow-light phenomena, giving rise to a class of slow-light devices including true-time photonic delay lines and compact Si electro-optic (EO) modulators with reduced phase shifter length. Both Bragg grating and photonic crystal line-defect (W1) based slow-light modulators will be presented. A reliability study on AIM fabricated photonic crystal waveguides towards slow-light applications will also be presented. The talk also includes examples of compact Si electro-optic modulator for complex integrated photonic systems such as on-chip delay-line reservoir computing, tunable delay lines for phased array antennas, and photonic tensor core computing.
Speaker Biography: Dr. Huang received her B.Sc. in Optical Physics from the Beijing Institute of Technology, followed by her M.Sc. and Ph.D. in Electrical Engineering and System Department from the Georgia Institute of Technology. Currently she us serving as an Associate Professor in the Electrical, Computer, and System Engineering Department at RPI. She has co-authored over 70 journal articles and conference proceedings. She received the Best Poster PRC Award (2nd place) in 1999, Outstanding Poster Paper Award of the 53th ECTC in 2003, Commendable Paper Award of IEEE Transaction in Advanced Packaging in 2004, and NSF RampUp Award in 2010.
The AIM Photonics Ecosystem and Technology Offerings
Colin McDonough
3D and Heterogeneous Integration Manager, AIM Photonics
Abstract: The American Institute for Manufacturing Integrated Photonics (AIM Photonics) has created a complete end-to-end manufacturing and design ecosystem that bridges the current gap between basic research and product development in the emerging photonic integrated circuit (PIC) industry. AIM Photonics offers accessible, state-of-the-art 300mm PIC and heterogeneous integration (HI) technology to advance domestic silicon photonic capabilities. Process design enablement, PIC & HI technologies, and test, assembly, & packaging at AIM Photonics will be discussed. Acknowledgements: This material is based on research sponsored by Air Force Research Laboratory under agreement number FA8650-21-2-1000 (AIM Photonics). The U.S. Government is authorized to reproduce and distribute reprints for Governmental purposes notwithstanding any copyright notation thereon. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of the United States Air Force, the Air Force Research Laboratory or the U.S. Government.
Speaker Biography: Colin McDonough leads the 3D & Heterogeneous Integration team for AIM Photonics under NY CREATES at the Albany NanoTech complex in Albany, NY. Colin focuses on the integration and packaging of silicon photonics and interposer technologies for AIM Photonics. He has led development efforts in 3D integration including TSV stress mitigation, wafer-to-wafer direct bonding for electro-optic heterogeneous integration, and on-chip laser integration. Colin earned his Ph.D. in Nanoscale Science & Engineering in 2011 at the University at Albany, State University of New York and is a Senior Member of IEEE.