The RPI Semiconductor CoLab Catalyst Seminar Series will continue on Tuesday, October 20th, 3:00–5:00 PM, in person at the ZEN Building, Albany NanoTech Complex. The seminar will feature Dureseti (Chidu) Chidambarrao (IBM) and Jacob Merson (RPI) discussing thermal challenges and solutions for 3DHI packages. The session is separated by a coffee break for networking, discussions and poster presentations.
Speakers:
Dureseti (Chidu) Chidambarrao, STSM, Thermal and Design-Technology-Manufacturing Solutions IBM Research
3DHI Thermal Challenges - A Length Scale Perspective
Jacob Merson, Assistant Professor, RPI
An Approach to Multiscale Thermal Modeling of 3DHI Packages
About the Series:
The RPI Semiconductor CoLab Catalyst Seminars bring together faculty, researchers, and industry partners to exchange ideas, highlight collaborations, and advance innovation in semiconductors and microelectronics.
Program Format:
Two 45-minute talks with a networking coffee break
Who Should Attend?
The event is open to faculty, students, researchers, alumni, and industry partners at Albany Nanotech Complex.
Participants are welcome to present posters during the break to reach broader audiences.
Registration Information:
The registration deadlines:
10/02 for non-US citizens
10/16 for US citizens and US permanent residents
Additional details, such as ID requirements and access to site, are available at the link.
Register here.