The RPI Semiconductor CoLab Catalyst Seminar Series will be held on Tuesday, March 17th, 3:00–5:00 PM, in person at the ZEN Building, Albany NanoTech Complex. The seminar will feature Jacob Merson (RPI) and Dureseti (Chidu) Chidambarrao (IBM Research) presenting on discussing on thermal challenges and solutions for 3DHI Packages, separated by a coffee break for networking, discussions and poster presentations.
Speakers:
Dureseti (Chidu) Chidambarrao, STSM, Thermal and Design-Technology-Manufacturing Solutions, IBM Research
3DHI Thermal Challenges - A Length Scale Perspective
Jacob Merson, Assistant Professor, RPI
An Approach to Multiscale Thermal Modeling of 3DHI Packages
About the Series:
The RPI Semiconductor CoLab Catalyst Seminars bring together faculty, researchers, and industry partners to exchange ideas, highlight collaborations, and advance innovation in semiconductors and microelectronics.
Program Format:
Two 45-minute talks with a networking coffee break
Who Should Attend?
The event is open to faculty, students, researchers, alumni, and industry partners at Albany Nanotech Complex.
Participants are welcome to present posters during the break to reach broader audiences.
Registration Information:
The registration deadlines:
Tuesday, March 3rd for non-US citizens
Friday, March 13th for US citizens and US permanent residents
Additional details, such as ID requirements and access to site, are available at the link.
Register here.