Center for Materials, Devices and Integrated Systems Seminar
November 12 (Friday), 2021: 12:00 pm – 1:00 pm (EDT)
“Advanced packaging of semiconductor devices: Driving Moore’s Law through Heterogeneous Integration”
by: Dr. Ami Eitan
Director, Advanced Packaging Technology and Service, TSMC
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Abstract: As the semiconductor industry is challenged to continue and follow (or exceed) Moore’s law to increase transistor density with time, TSMC is driving progression of Si technology nodes. Together with that effort, and to enable product design flexibility in all segments, advanced packaging innovations are playing a critical role in the overall transistor density increase.
The presentation will introduce the semiconductor environment and will focus mainly on the innovations in advanced packaging, to enable heterogenous integration of Si devices. A special focus will be on the inter-die joint formation technology development. TSMC’s advanced packaging technology capabilities will be introduced, and fundamental topics around enabling these capabilities will be discussed.
Biography: Ami Eitan received his B.Sc. in Chemical Engineering from Ben-Gurion University, Israel, his M.Sc. in Chemistry from the Weizmann Institute of Science, Israel, and his Ph.D. in Materials Science and Engineering from Rensselaer Polytechnic Institute, Troy, NY.
His work experience includes the Governmental Research Laboratories in Israel, as the materials Department Head, Intel Corporation, as the head of the Technology Development of assembly interconnect department, and now he is a director in the Advanced Packaging Technology and Service organization at TSMC, in Taiwan.
Ami’s areas of expertise include polymer-based composites, characterization of polymer systems, materials and process development for semiconductor packaging applications, and inter-device interconnect technology development.
Ami is happy to share his experience with the RPI community, it feels like home.
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contact: Deniz Rende (rended3@rpi.edu)